INTEL 10MN PROCESS

Intel_logoWe now have some better details with Intel’s 10nm line that has been slow to get into production. The first  Canon Lake CPU was found in the new Lenovo Ideapad 330 with the i3-8121U.

The i3-8121U is a dual core CPU with hyperthreading. It runs at 2.2 Ghz with a boost frequency of 3.2 GHz. The CPU has 2x 32KB of L1 cache, 2x 64KB L2 cache and 2x 2MB L3 cache. The TDP is jst 15W. The CPU supports up to 32GB of DDR4 or LPDDR4.

The 10nm lithography packs 2.7 times more transistors per square  than the best achieved with 14nm. Intel has been able to pack up to 100.8 million transistors into a square millimeter, So a 127mm² die could have as many as 12.8 billion transistors.,

  • Utilizes third generation FinFET technology
  • Minimum gate pitch of Intel’s 10 nm process shrinks from 70 nm to 54 nm
  • Minimum metal pitch shrinks from 52 nm to 36 nm
  • Deepest scaled pitches of current 10 nm and upcoming 7 nm technologies
  • First Co metallization and Ru usage in BEOL
  • New self-aligned patterning schemes at contact and BEOL
  • Hyperscaling via 6.2-Track high density library
  • Contact on active gate (COAG) cell-level usage

While cobalt has higher resistance than copper, once the wires get smaller copper resistance rises making cobalt the material of choice. At 10nm Intel uses cobalt metalization with copper reserved for larger connections. Cobalt seems to be best for middle of the line layers,

The Cannon Lake processors will be slowly introduced over the next 6 to 12 months as Intel slowly increases production.

NB: BEOL is back end of the line, the stage where in modern circuits as many as 10 layers of metal interconnect are added etc.